Item |
Specification |
Remarks |
Number of Layer |
1-14 layers |
|
Material |
CEM-3,FR-4 |
High Tg CCL Is Available |
Finish Board Thickness |
0.2mm-3.20mm |
|
( 8mil-126mil) |
Minimun Core Thickness |
0.075mm(3mil) |
|
Copper Thickness |
1/2 oz min; 3 oz max |
|
Min.Trace Width & Line Spacing |
0.075mm/0.1mm(3mil/4mil) |
|
Min.Hole Diameter for CNC Driling |
0.25mm(12mil) |
|
Min.Hole Diameter for Punching |
0.9mm(35mil) |
|
Biggest Pabek Sise |
700mm¡Á510mm |
|
|
Dunebsuib
Tikerabce |
Hole Positon |
+/-0.075mm(3mil) CNC Driling |
|
Conductor Width(W) |
+/-0.05mm(2mil)or |
|
+/-20% of original artwork |
Hole Diameter(H) |
PTH L:+/-0.075mm(3mil) |
|
Non-PTH L:+/-0.05mm(2mil) |
Outline Tolerance |
+/-0.125mm(5mil) CNC Routing |
|
+/-0.15mm(6mil) by Punching |
Warp & Twist |
0.7% |
|
Insulation Resistance |
£¼50ohm |
|
Test Voltage |
300V |
|
V-Cutting |
Panel Size |
110¡Á100mm(min) |
Jump Score Is Available |
660¡Á600mm(max) |
Multilayers |
Layer-layer misregistration |
4 layers:0.15mm(6mil)max |
|
6 layers:0.25mm(10mil)max |
Min.spacing between hole edge to circuity pqttern of an inner layer |
0.25mm(10mil) |
|
Min.spacing between board oulineto circuitry pattern of an inner layer |
0.25mm(10mil) |
|
Board thickness tolerance |
4 layers:+/-0.13mm(5mil) |
|
6 layers:+/-0.15mm(6mil) |
Impedance Control |
20-75 ohm+/-10% |
|
Different Impendance |
75-150 ohm+/-10% |
|
Finish Board Surface |
HASL,OSP,Au /agimmersion,Au Plating Etc |
