Circuit Board Specifications
Maximum Panel size: 19.7ˇ± x 31.5ˇ±
Maximum Number of Layers: 1-30
Copper Thickness: 0.5 oz to 5.0 oz
Minimum Line Width: 3 mil
Minimum Line spacing: 3 mil
Smallest Hole: 0.006ˇ±
Blind, Buried and plugged Vias
Controlled impedance |
Material
Thickness: 0.008ˇ± to 0.240ˇ±
FR-4
High TG FR-4
PTFE
Aluminum Base
Rogers
Specialized material per your request |
Solder Mask
LPI¨CGreen, Yellow, Black, Red, Blue etc.
Peelable Mask
Inspection Methods
100% Visual inspection
Electrical testing ¨C Flying probe or Nails Bed
Sample lot inspection
Cross sectioning |
Final Finishes
SMOBC (HASL)
Carbon
Selective Gold Plating
Hard and Soft Gold
Immersion Gold
Immersion Silver
Immersion Tin
OSP |
